Two ultra-stable Blue M Ovens for soft and hard baking of photoresists as well as post coat baking of spin on dopants and spin on glass are available in the lithography bay.
The Brewer Science Cee stand-alone spin coater / hotplate is dedicated for the spinning of electron beam resists. The tool is capable of spin coating substrates up to 7” square or 200-mm round and features high torque for maximum ramping capability. You can also spin coat smaller size substrates (<1-cm through 200-mm) using a wide array of spin-coating chuck sizes. The precision hotplate has a temperature range from ambient to 300˚C with resolution of +/- 0.1˚C and uniformity of 0.3% across the working surface.
Two additional Brewer Cee spin coaters are located in the fume hoods in the lithography bay. Spin coater # 2 is dedicated for photoresist processing, and spin coater # 3 is dedicated to all other non-standard materials, such as spin-on glasses, PVA, PPC, charge spreading layers for e-beam, and 3D laser lithography resists. The tools are capable of spin coating substrates up to 7” square or 200-mm round and features high torque for maximum ramping capability. You can also spin coat smaller size substrates (<1-cm through 200-mm) using a wide array of spin-coating chuck sizes.
The Elionix ELS-G100 is a high speed, ultra high precision thermal field emission electron beam lithography system. The ELS-G100 is capable of generating patterns with a line width of 6nm. The system provides a stable 1.8nm electron beam using high beam current at 100kV.
A laser interferometer stage, with reading resolution of 0.31nm, enables a stitching accuracy of 15nm and overlay accuracy of 20nm. Significantly small distortion enables uniform and stable fine pattern writing over large writing fields. Uniform 10nm lines can be drawn from the edge to the edge of a 500_m field without stitching. At a beam current of 1nA, 20nm lines can be written over an entire 500_m field without stitching. No stitching guarantees accuracy and eliminating the need for stage movement enhances writing speed.
The EVG620 is a mask aligner equipped with high-resolution top and/or bottom side microscopes for single or double-side photolithography. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput. The system is configured with the NanoAlign Technology Package, increasing EVG620 aligner microscope resolution by a factor of approximately 2.
The Nova NanoSEM™ is a high resolution scanning electron microscope intended for sample characterization. In addition to the SEM features, the Nova system is configured with a beam blanker and the Raith ELPHY Quantum software to enable electron beam lithography for users who do not require the ultra-high resolution of the Elionix system.
The Nanoscribe Photonic Professional is an easy-to-operate table-top laser lithography system that enables the fabrication of true three-dimensional nanostructures using commercially available photoresists. Designed for the fabrication of photonic crystal structures, the instrument is also ideal for, e.g., generating three-dimensional scaffolds for biology, micro- and nanofluidic circuitry.
The hot plate tower is a vented tower that holds several dedicated hotplates for pre and post baking ebeam and photo resists. In addition, two Blue M Ovens for soft and hard baking of photoresists as well as post coat baking of spin on dopants and spin on glass are also available in the lithography bay.
SAMCO’s UV-1 is a compact, benchtop, UV-ozone cleaning system that will not damage delicate electronic devices. The system utilizes a combination of ultraviolet radiation, ozone, and heat to organic materials from a variety of substrates; these include silicon, gallium arsenide, sapphire, metals, ceramics, quartz and glass.
The UV-1 is suited for applications involving substrate cleaning, photoresist descumming, improving wettability and UV curing.
The system is compatible with substrates up to 150mm in diameter and up to 15mm-thick. The substrate heater is capable of temperatures from ambient to 300C.