Oxford Plasma Enhanced Chemical Vapor Deposition

Equipment Type

Plasma Enhanced Chemical Vapor Deposition (PECVD)

Manufacturer

Oxford Instruments

Model

PlasmaPro NPG80 PECVD

Location

Deposition Bay

Processes

Gases: N2, O2, N2O, NH3, SiH4/Ar, CF4, CH4

The Oxford PlasmaPro System 100 PECVD is load locked tool, capable of depositing silicon oxide, silicon nitride, amorphous silicon, and other films (under staff permission). The PECVD has a 600W 13.56 MHz plasma source and has an electrically heated lower electrode, capable of a maximum temperature of 400C. Additionally, the system has a 100kHz low frequency generator connected to the top electrode. The tool is capable of processing wafers up to 8” in diameter, down to smaller wafers and chips.

oxford-pecvd