Oxford Reactive Ion Etch

Equipment Type

Reactive Ion Etch (RIE)

Manufacturer

Oxford Instruments

Model

PlasmaPro NPG80 RIE

Location

Plasma Bay

Processes

Gases: SF6, CH4, CF4, Ar, N2, O2

The Oxford PlasmaPro NPG80 RIE is an open-load medium plasma density system configured for fluorine-based etch chemistries, which can accommodate pieces to wafers up to 8” in diameter and 3 cm thick. This tool is configured with a fluorine chemistry to etch silicon, its oxides and nitrides, and polymers including photoresist and silicone elastomers.

The system has a 300 W 13.56 MHz RF power source coupled to a solid state matching network. The active electrode is equipped with a heater/chiller and is capable of operating at temperatures varying from 0_C to +80_C.

oxford-rie